Present and Future of Build-up PWB's-Their Possibility and Limitation. Current Dielectric Material for Build-up Printed Wiring Board and Their Challenge.
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چکیده
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architecture and engineering of nanoscale sculptured thin films and determination of their properties
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ژورنال
عنوان ژورنال: Journal of Japan Institute of Electronics Packaging
سال: 1999
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.2.430